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Abstract:
针对低Ag无铅焊膏的市场需求,研究开发了一种适用于99.0Sn0.3Ag0.7Cu低Ag无铅焊膏用松香型无卤素助焊剂(WTO-LF3000),配制了相应的无铅焊膏(WTO-LF3000-SAC0307),并对其板级封装工艺适应性及焊点可靠性进行了考察,用测试后样品的电气可靠性作为接头可靠性评价条件.结果表明:所开发的低Ag无铅焊膏熔点和润湿性符合产品实际要求.配制的焊膏印刷质量良好,焊点切片观察其孔隙率<25%,满足行业标准IPC-A-610D之要求.样品分别经跌落、震动和温度循环试验后,无焊点脱落等现象,电气功能正常.
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电子元件与材料
ISSN: 1001-2028
Year: 2010
Issue: 3
Volume: 29
Page: 79-81
Cited Count:
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count: 10
Chinese Cited Count:
30 Days PV: 2
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