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Author:

Meng Gang (Meng Gang.) | Li Bolong (Li Bolong.) | Li Hongmei (Li Hongmei.) | Huang Hui (Huang Hui.) (Scholars:黄晖) | Nie Zuoren (Nie Zuoren.) (Scholars:聂祚仁)

Indexed by:

EI Scopus SCIE

Abstract:

The hot deformation behavior of an Al-5.7 wt.%Mg alloy with erbium has been investigated. Compression tests are performed in the temperature range of 300-500 degrees C and in the strain rate ranging from 0.001 s(-1) to 50 s(-1) up to a true strain of 0.7. The processing maps are developed at different strains and the standard kinetic analysis has been applied to evaluate the rate controlling mechanisms. The processing maps have exhibited two domains of 350-450 degrees C at 0.001-0.03 s(-1) and 450-500 degrees C at 0.01-1 s(-1), representing dynamic recovery of Al-5.7 wt.%Mg with erbium. The apparent activation energies estimated in these two domains are 180 kJ/mol and 163 kJ/mol respectively, which suggests that cross-slip of dislocation and lattice self-diffusion are the deformation mechanisms. At strain rates higher than 10 s(-1), the flow curves demonstrate flow softening behavior, and the flow instability regions reveal mixed microstructure of local deformation and dynamic recrystallization. (C) 2009 Elsevier B.V. All rights reserved.

Keyword:

Kinetic analysis Processing maps Rare earth erbium Al-Mg alloy Hot deformation

Author Community:

  • [ 1 ] [Meng Gang]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Li Bolong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Li Hongmei]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Huang Hui]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Nie Zuoren]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Meng Gang]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

ISSN: 0921-5093

Year: 2009

Issue: 1-2

Volume: 517

Page: 132-137

6 . 4 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 65

SCOPUS Cited Count: 95

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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