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Abstract：
Rapid tin whisker growth has been found in Sn-3.8Ag-0.7Cu1.0Er solder joints. The morphology of the tin whiskers changes from rodlike to threadlike when the storage temperature increases from 25 A degrees C to 150 A degrees C. The compressive stress induced by the lattice expansion of the oxidized ErSn3 phase provides the driving force and the tin atoms released from the oxidization of the ErSn3 phase provide the material source for the tin whisker growth.
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METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
ISSN： 1073-5623
Year： 2009
Issue： 8
Volume： 40A
Page： 2016-2021
2 . 8 0 0
JCR@2022
ESI Discipline： MATERIALS SCIENCE;
JCR Journal Grade：1
Cited Count：
WoS CC Cited Count： 6
SCOPUS Cited Count： 8
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 0
