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Abstract:
研究了用于铝合金钎焊的新型Al-Si-Cu-Ge系钎料,通过快冷工艺制备了厚度90μm~150μm的钎料薄带.对所研究钎料的熔化温度区间及金相组织进行了分析和判定,结果表明:与Al-9.6Si-20Cu钎料相比,钎料熔化温度大幅降低;普通钎料和快冷钎料的固相线相差30℃左右,液相线差别约5℃;普通钎料的微观组织主要由Al-Si-Cu-Ge、Al-Si-Ge和Al-Cu共晶相、Si-Ge先析出相及θ(Al2Cu)相组成;快冷钎料晶粒尺寸范围约1 μm~5μm.
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电子工艺技术
ISSN: 1001-3474
Year: 2005
Issue: 2
Volume: 26
Page: 68-70,74
Cited Count:
WoS CC Cited Count: 0
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count: 28
Chinese Cited Count:
30 Days PV: 1
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