Particle-enhancement　is　the　way　to　improve　properties　of　solder　alloys.　In　the　present　work,　the　influence　of　silver　particles　on　the　wettability　and　creep　rupture　life　of　99.3Sn-0.7Cu　solder　with　containing　silver　particles　of　1　vol%　to　10　vol%　was　investigated.　It　is　shown　that　the　wettability　of　the　composite　solders　can　be　improved　by　adding　minute　amount　of　silver　particles.　When　silver　is　less　than　5vol%,　the　wettability　of　the　composite　is　increased.　When　silver　is　more　than　5vol%,　the　wetting　is　decreased.　When　silver　is　up　to　10vol%,　the　wettability　of　the　composite　solder　is　sharply　deteriorated.　In　addition,　the　creep　rupture　lives　of　the　composite　solders　are　longer　than　that　of　99.3Sn-0.7Cu　solder　at　the　same　condition.　When　silver　is　5　vol　%,　the　creep　rupture　life　of　the　composite　solder　is　the　longest　among　the　investigated　composite　solders,　and　it　is　about　23　times　of　that　of　99.3Sn-0.7Cu　solder.