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Author:

Zhao, Songqing (Zhao, Songqing.) | Zhou, Yueliang (Zhou, Yueliang.) | Liu, Yuzi (Liu, Yuzi.) | Zhao, Kun (Zhao, Kun.) | Wang, Shufang (Wang, Shufang.) | Xiang, Wenfeng (Xiang, Wenfeng.) | Liu, Zhen (Liu, Zhen.) | Han, Peng (Han, Peng.) | Zhang, Ze (Zhang, Ze.) | Chen, Zhenghao (Chen, Zhenghao.) | Lu, Huibin (Lu, Huibin.) | Jin, Kuijuan (Jin, Kuijuan.) | Cheng, Bolin (Cheng, Bolin.) | Yang, Guozhen (Yang, Guozhen.)

Indexed by:

EI Scopus SCIE

Abstract:

B-doped ZnO thin films have been fabricated on fused quartz substrates using boron-ZnO mosaic target by pulsed-laser deposition technique, and the mechanical properties have been studied by nanoindentation continuous stiffness measurement technique and transmission electron microscope (TEM). Nanoindentation measurement revealed that the hardness of B-doped ZnO films, 9.32 +/- 0.90 to 12.10 +/- 1.00 GPa, is much greater than that of undoped ZnO films and very close to that of traditional semiconductor Si. The mean transmittance (%) is larger than 81% in the visible range (380-780 nm) for all the films, and the Hall effect measurement showed that the carrier density is around 2 x 10(20) cm(-3) and the resistivity lower than 3 x 10(-3) Omega cm. TEM characteristics show undoped thin films have more amorphous area between grains while the B-doped ZnO films have thin grain boundaries. We suggest that the grain boundaries act as the strain compensation sites and the decrease in thickness of grain boundaries enhances the hardness of the B-doped ZnO films. (c) 2006 Elsevier B.V. All rights reserved.

Keyword:

hardness nanoindentation B-doped TEM ZnO thin film

Author Community:

  • [ 1 ] Chinese Acad Sci, Beijing Natl Lab Condensed Matter Phys, Inst Phys, Beijing 100080, Peoples R China
  • [ 2 ] Beijing Univ Technol, Beijing 100022, Peoples R China

Reprint Author's Address:

  • [Zhou, Yueliang]Chinese Acad Sci, Beijing Natl Lab Condensed Matter Phys, Inst Phys, Beijing 100080, Peoples R China

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Source :

APPLIED SURFACE SCIENCE

ISSN: 0169-4332

Year: 2006

Issue: 2

Volume: 253

Page: 726-729

6 . 7 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count: 30

SCOPUS Cited Count: 31

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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