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Author:

Yang, Jingang (Yang, Jingang.) | Yu, Tianmiao (Yu, Tianmiao.) | Wei, Sinan (Wei, Sinan.) | Wang, Xinpeng (Wang, Xinpeng.)

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CPCI-S EI Scopus

Abstract:

The structure and basic principle of heat pipe and plate micro heat pipe array are introduced in detail, and the application of FLUENT grid technology and numerical technique is introduced. The thermal conductivity, the phase change and the effect of the liquid filling rate on the heat transfer performance of the heat pipe were simulated by using FLUENT of CFD software. The results show that when the liquid filling rate is 20% similar to 30%, the thermal conductivity of the micro heat pipe starts to rise, reaching 6.11 x 10-5 W . m-2 at the highest level. When the liquid filling rate of 30% to 40%, the thermal conductivity of the micro-heat pipe began to decline, which indicates that the best filling rate is when the liquid filling rate is 20 similar to 30. When the temperature of the outer wall of the condensation section is 67.5 degrees C, the maximum heat flux can reach 8.1 x 105 W x m-2.

Keyword:

Author Community:

  • [ 1 ] [Yang, Jingang]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Yang, Jingang]Jilin Jianzhu Univ, Changchun 130021, Jilin, Peoples R China

Reprint Author's Address:

  • [Yang, Jingang]Beijing Univ Technol, Beijing 100124, Peoples R China;;[Yang, Jingang]Jilin Jianzhu Univ, Changchun 130021, Jilin, Peoples R China

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Source :

2019 5TH INTERNATIONAL CONFERENCE ON ENERGY MATERIALS AND ENVIRONMENT ENGINEERING

ISSN: 1755-1307

Year: 2019

Volume: 295

Language: English

Cited Count:

WoS CC Cited Count: 1

SCOPUS Cited Count: 2

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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