Indexed by：
Abstract：
Tensile specimens with a Cu/IMC/solder/IMC/Cu structure were prepared, and were treated by 0h, 72h, 168h, 288h, 500h, 1000h isothermal aging processing at 150 degrees C. Quasi-static tensile tests were conducted on the micro-tester Instron5948, Fracture analysis of fractured specimens was conducted by optical microscopy and scanning electron microscopy. Two fracture modes were found, and the fracturing surface tends to be flat with the aging time increases.
Keyword：
Reprint Author's Address：
Source ：
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
Year： 2013
Page： 861-,
Language： English
Cited Count：
WoS CC Cited Count： 1
SCOPUS Cited Count：
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 1
Affiliated Colleges：
