The　microstructure　and　texture　evolution　of　Ni-5　at%W　(Ni5W)　alloy　substrates　were　investigated　by　in　situ　tensile　testing　along　the　rolling　direction　(RD),　transverse　direction　(TD),　and　at　45　degrees　to　the　RD　(45　degrees-RD),　as　well　as　by　electron　backscatter　diffraction　characterization.　The　tensile　stress　direction　had　a　significant　influence　on　the　texture　evolution.　The　cubic　texture　in　the　Ni-5　at%W　alloy　exhibited　severe　degradation　when　the　tensile　angle　was　45　degrees-RD.　In　contrast,　the　cubic　texture　was　relatively　stable　under　high　deformation　along　the　RD　or　TD.　It　was　found　that　the　slip　line　system　in　the　45　degrees-RD　specimen　was　the　key　to　the　contrasting　behavior.　The　effect　of　the　tensile　testing　angle　on　the　cubic　texture　evolution　for　Ni-W　substrates　was　investigated,　and　the　corresponding　effect　on　the　superconducting　properties　of　coated　materials　was　studied.