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Author:

秦飞 (秦飞.) (Scholars:秦飞) | 别晓锐 (别晓锐.) | 陈思 (陈思.) | 安彤 (安彤.) | 振动与冲击 (振动与冲击.)

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CQVIP

Abstract:

随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型

Keyword:

Steinberg模型 随机振动 塑封球栅阵列(PBGA)封装 有限元分析(FEA) 寿命预测

Author Community:

  • [ 1 ] 北京工业大学机械工程与应用电子技术学院电子封装技术与可靠性研究所,北京100124
  • [ 2 ] 工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术国家重点实验室,广州510610

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Source :

秦飞

ISSN: 1000-3835

Year: 2021

Issue: 2

Volume: 40

Page: 164-170

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count: -1

30 Days PV: 0

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