Fusion　bonding　with　Nd:　YAG　laser　method　between　silicon　and　glass　at　low　temperature　has　been　successfully　demonstrated.　This　method　could　overcome　the　movable　mechanical　parts　damages　brought　by　the　electrostatics　force　in　MEMS　(Micro-electronic-machine-system-MEMS)　device　during　the　anodic　bonding.　What＇s　more,　it　could　make　silicon　wafer　and　glass　bonded　successfully　at　low　temperature　for　the　Au/Si　alloy　fusion　temperature　is　365　degrees　C.