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Author:

Chen, Dongju (Chen, Dongju.) (Scholars:陈东菊) | Wu, Shuiyuan (Wu, Shuiyuan.) | He, Yazhong (He, Yazhong.) | Luo, Yuchi (Luo, Yuchi.) | Wang, Xiang (Wang, Xiang.)

Indexed by:

EI Scopus SCIE

Abstract:

Nanocutting is a method of direct machining in nanomanufacturing field, and it is an important ultraprecision machining method. Nanocutting technology adopts single-point diamond cutting and nanoprobe scratching methods to make the machining accuracy of parts reach the nanometric scale. It is the method with the highest machining accuracy at present, so it is widely used in the processing of precision components. At the same time, nanocutting technology can be used to process nanostructures and provide processing methods for basic research in condensed matter physics. This paper summarized the cutting mechanism and cutting force in the nanocutting process, including the mechanism of nanocutting and brittle-ductile transition. The influence of RTS, temperature, wear and subsurface phase transformation on cutting performance is also discussed. At the same time, the characteristics of cutting force and friction coefficient during the cutting process are reviewed. After that, the simulation and experiment research of the nanocutting process are analyzed. At the end of the paper, the challenges and prospects of nanocutting technology are proposed and summarized.

Keyword:

Experiment Wear Nanomanufacturing Cutting Subsurface

Author Community:

  • [ 1 ] [Chen, Dongju]Beijing Univ Technol, Fac Mat & Mfg, Beijing, Peoples R China
  • [ 2 ] [Wu, Shuiyuan]Beijing Univ Technol, Fac Mat & Mfg, Beijing, Peoples R China
  • [ 3 ] [He, Yazhong]Beijing Univ Technol, Fac Mat & Mfg, Beijing, Peoples R China
  • [ 4 ] [Luo, Yuchi]China Acad Engn Phys, Inst Nucl Phys & Chem, Mianyang, Sichuan, Peoples R China
  • [ 5 ] [Wang, Xiang]Jingdezhen Ceram Inst, Sch Mech & Elect Engn, Jingdezhen, Jiangxi, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

ISSN: 0268-3768

Year: 2022

3 . 4

JCR@2022

3 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:49

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 7

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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