This　paper　presents　the　design　of　a　cooling　device　for　microelectronic　device　applications.　The　proposed　device　uses　parallel　plate　capacitor　electrical　bias　to　generate　an　electrostatic　force　that　acts　on　the　coolant　to　enable　control　of　the　coolant　flow　in　the　radiator.　Through　a　combination　of　the　structural　design　of　the　device　and　the　application　of　an　electrical　bias　on　both　sides　of　multiple　parallel　plate　capacitor　electrodes,　the　generation　of　a　radiator　coolant　eddy　current　is　realized,　and　the　functions　of　cooling　and　heat　transfer　are　realized　for　microelectronic　devices　placed　on　the　surface　of　the　base　platform.　Based　on　this　principle,　a　finite　element　multi-physical　field　simulation　was　used　to　simulate　the　flow　heat　transfer　function　of　the　coolant　in　the　device　under　the　action　of　the　electrostatic　force　and　the　effects　of　the　channel　diameter,　channel　spacing,　voltage,　and　liquid　storage　tank　depth　on　the　peak　coolant　velocity　were　studied.　In　addition,　3D　printing　technology　was　used　to　fabricate　the　heat　dissipation　device.　The　heat　dissipation　device　was　tested　by　charging,　with　a　basic　realization　of　the　function　of　controlling　the　cooling　liquid　flow　in　the　heat　dissipation　device　demonstrated.　The　device　realizes　radiator　coolant　flow　rate　control　through　voltage　control　and　has　characteristics　that　include　low　energy　consumption　and　a　convenient　and　compact　structure.　©　Published　under　licence　by　IOP　Publishing　Ltd.