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Author:

雷永平 (雷永平.) (Scholars:雷永平) | 徐冬霞 (徐冬霞.) | 夏志东 (夏志东.) | 史耀武 (史耀武.) | 郭福 (郭福.) (Scholars:郭福) | 张冰冰 (张冰冰.) | 王友山 (王友山.)

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incoPat

Abstract:

一种无铅焊料专用水溶性助焊剂属于无铅焊料助焊剂领域。本发明针对现有含铅焊料助焊剂对无铅焊料的不适应性,由下述重量百分数物质组成:硼酸和有机酸活化剂5.0-10.0%、非离子表面活性剂或阳离子表面活性剂0.1-1.0%、助溶剂8.0-20.0%、成膜剂0.1-1.0%、缓蚀剂0.1-0.5%,其余为去离子水。配制方法如下:加入助溶剂和部分去离子水,搅拌下加入成膜剂,溶解后加余量去离子水、活化剂和表面活性剂,然后加入缓蚀剂,搅拌至固体物溶解,静置过滤后保留滤液即得本发明助焊剂。本发明不含松香,无卤化物,环保,对无铅焊料助焊性能优越,焊点饱满,铺展均匀,腐蚀小,焊后残余物可溶于水,用水清洗后,干燥铜板,测试板子的表面绝缘电阻均大于1.0×1011Ω,可满足高可靠性产品的要求。

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Patent Info :

Type: 发明授权

Patent No.: CN200610076272.5

Filing Date: 2006-04-21

Publication Date: 2008-08-06

Pub. No.: CN100408257C

Applicants: 北京工业大学

Legal Status: 未缴年费

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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