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Author:

Niu, Xin-Huan (Niu, Xin-Huan.) | Wang, Yi (Wang, Yi.) | Liu, Zhuang-Zhuang (Liu, Zhuang-Zhuang.) | Wang, Shan-Fei (Wang, Shan-Fei.) | Ji, Yao-Tang (Ji, Yao-Tang.) | Zhang, Xiao-Long (Zhang, Xiao-Long.) | Liang, Xiang -Yu (Liang, Xiang -Yu.) | Suo, Wen-Hua (Suo, Wen-Hua.) | Suo, Hong-Li (Suo, Hong-Li.)

Indexed by:

EI Scopus SCIE

Abstract:

Hastelloy C-276 alloy is the preferred substrate for YBa2Cu3O7-delta (YBCO) coated conductors prepared by Ionbeam-assisted deposition (IBAD) route, but its surface is too rough to meet application requirements. Y (CH3COO)3 & sdot;4H2O precursor solution has a low flattening efficiency, and its film edges are prone to crack formations. In this paper, a model for the stress intensity factor was established to study the effect of the presence of cracks on film stress. The simulation results showed that increasing the coating thickness reduced the overall stress, but increased the stress concentration at the crack. The larger bottom layer defects also made it easier for cracks to be generated. Then, 10-m long Hastelloy C-276/Y2O3 strips were prepared by colloidal-solution deposition planarization (CSDP), with an average surface roughness Rq of 0.427 and only 10 coating layers. This improved the flattening efficiency by 40 %, and a CeO2 layer with a good biaxial texture was finally prepared.

Keyword:

(CSDP) Colloid -solution deposition planarization Cracks Coating thickness Stress intensity factor Bottom layer defects

Author Community:

  • [ 1 ] [Niu, Xin-Huan]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Wang, Yi]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Liu, Zhuang-Zhuang]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Wang, Shan-Fei]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Zhang, Xiao-Long]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 6 ] [Liang, Xiang -Yu]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 7 ] [Suo, Wen-Hua]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 8 ] [Suo, Hong-Li]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 9 ] [Ji, Yao-Tang]Liaocheng Univ, Sch Mat Sci & Engn, Liaocheng 252059, Shandong, Peoples R China

Reprint Author's Address:

  • [Wang, Yi]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

CERAMICS INTERNATIONAL

ISSN: 0272-8842

Year: 2024

Issue: 7

Volume: 50

Page: 10446-10455

5 . 2 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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