As　a　prominent　limiting　factor　in　the　performance　of　microelectronic　devices,　the　improvement　of　heat　dissipation　is　of　utmost　importance.　The　enhancement　of　heat　and　mass　transfer　during　boiling　by　nanostructured　surfaces　has　been　demonstrated　in　many　studies.　In　this　study,　a　nanoscale　flow-boiling　model　is　developed　by　molecular　dynamics　method　in　order　to　deeply　investigate　the　microscopic　mechanism　of　nanostructureenhanced　heat　transfer.　Simple　liquid　argon　is　heated　by　grooved　substrate　to　explore　the　effect　of　the　depth　of　the　cavities　on　the　boiling　heat　transfer.　The　results　indicate　that　the　grooved　surface　improves　heat　transfer　performance　through　two　key　mechanisms.　Firstly,　it　induces　bubble　nucleation,　and　secondly,　it　delays　the　onset　of　film　boiling.　The　presence　of　cavities　allows　the　argon　atoms　within　to　absorb　additional　energy　from　the　surrounding　walls　and　be　in　closer　proximity　to　the　heating　layer.　This　reduction　in　solid　thermal　resistance　results　in　increased　heat　transfer　efficiency,　leading　to　earlier　bubble　nucleation　and　a　greater　propensity　for　nucleation　within　the　cavities.　The　low　horizontal　velocity　of　argon　atoms　within　the　cavities　suggests　their　ability　to　retain　a　significant　number　of　atoms,　thereby　effectively　mitigating　the　deterioration　of　heat　transfer　caused　by　the　formation　of　a　vapor　film　on　the　solid　wall.　The　comprehensive　performance　is　observed　to　improve　with　increasing　depth　of　the　cavities　within　the　range　investigated　in　this　study.