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Author:

Zhen, Wen (Zhen, Wen.) | Tai, Feng (Tai, Feng.) | Guo, Fu (Guo, Fu.) (Scholars:郭福)

Indexed by:

EI Scopus PKU CSCD

Abstract:

Nano-sized polyhedral oligomeric silsesquioxane-TriSilanol cyclohexyl (POSS) particulates reinforced Sn-3.5Ag composite solder joint could improve mechanical reliability. The 3% fraction of POSS reinforcement is the best weight fraction. The welding characterization of POSS reinforcement in 3% POSS/Sn-Ag composite solder was analyzed through differential scanning calorimeter (DSC) analysis based on former experimental results in this paper. Results indicate that the welding temperature of 3% POSS/Sn-Ag composite solder is similar to that of Sn-3.5Ag eutectic solder, so 3% POSS/Sn-Ag composite solder has acceptable processing property. In addition, according to DSC analysis, 3% POSS/Sn-Ag composite solder has higher activation energy. It demonstrates that POSS reinforcements might be present in the Sn boundaries.

Keyword:

Reinforcement Particle reinforced composites Oligomers Differential scanning calorimetry Activation energy Lead-free solders Binary alloys Activation analysis Welding

Author Community:

  • [ 1 ] [Zhen, Wen]Beijing Polytechnic, Beijing 100026, China
  • [ 2 ] [Tai, Feng]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Guo, Fu]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

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Source :

Acta Materiae Compositae Sinica

ISSN: 1000-3851

Year: 2014

Issue: 1

Volume: 31

Page: 166-170

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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