In　order　to　improve　the　low　temperature　co-fired　ceramic　(LTCC)　as　the　substrate　of　RF　components　in　the　work　of　high　temperature　problem,　this　paper　aims　to　modify　the　internal　structure　and　materials　of　T/R　components,　with　the　goal　of　improving　the　high-temperature　working　environment　of　T/R　component　chips.　By　doing　so,　it　hopes　to　modify　the　heat　transfer　path　of　chips　and　the　thermal　conductivity　of　LTCC　substrates,　which　will　improve　the　heat　dissipation　performance　of　LTCC　RF　System-in-Package　(SiP)　components.　Simulation　is　carried　out　using　ICEPAK　finite　element　software　to　simulate　the　model　with　increasing　heat　transfer　path　and　increasing　thermal　conductivity　of　the　structure.　It　is　found　that　increasing　the　heat　transfer　path　can　effectively　reduce　the　temperature　of　the　TR　component　chip　during　operation,　and　the　heat　dissipation　effect　is　improved　less　after　further　improving　the　thermal　conductivity　of　the　structure.