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Author：

Shi, Yaowu (Shi, Yaowu.) | Liu, Jianping (Liu, Jianping.) | Xia, Zhidong (Xia, Zhidong.) | Lei, Yongping (Lei, Yongping.) (Scholars：雷永平) | Guo, Fu (Guo, Fu.) (Scholars：郭福) | Li, Xiaoyan (Li, Xiaoyan.)

Indexed by：

EI Scopus

Abstract：

In　the　present　work,　the　creep　strain　of　solder　joints　is　measured　using　a　stepped　load　creep　test　on　a　single　specimen.　Based　on　the　experimental　results,　the　constitutive　model　on　the　steady-state　creep　strain　is　established　by　applying　a　linear　curve　fitting　for　the　nano-sized　Ag　particle-reinforced　Sn37Pb　based　composite　solder　joint　and　the　Sn37Pb　solder　joint,　respectively.　It　is　indicated　that　the　activation　energy　of　the　Ag　particle-reinforced　Sn37Pb　based　composite　solder　joints　is　higher　than　that　of　Sn37Pb　solder　joints.　It　is　expected　that　the　creep　resistance　of　the　Ag　particle-reinforced　Sn37Pb　based　composite　solder　joints　is　superior　to　that　of　Sn37Pb　solder.　©　2009　Springer　Science+Business　Media,　LLC.

Keyword：

Silver Particle reinforced composites Activation energy Binary alloys Tin alloys Lead alloys Creep resistance Reinforcement Curve fitting Creep testing Creep

Author Community：

  • [ 1 ] [Shi, Yaowu]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
  • [ 2 ] [Liu, Jianping]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
  • [ 3 ] [Xia, Zhidong]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
  • [ 4 ] [Lei, Yongping]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
  • [ 5 ] [Guo, Fu]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China
  • [ 6 ] [Li, Xiaoyan]School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100022, China

Reprint Author's Address：

Email：


shiyw@bjut.edu.cn
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Source ：

Journal of Materials Science: Materials in Electronics

ISSN： 0957-4522

Year： 2010

Issue： 3

Volume： 21

Page： 256-261

2 . 8 0 0

JCR@2022

ESI Discipline： MATERIALS SCIENCE;

JCR Journal Grade：3

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 8

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 1

Affiliated Colleges：

材料与制造学部 本学院/部未明确归属的数据

材料与制造学部 材料科学与工程学院

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