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Author:

Wei, Jun (Wei, Jun.) | Song, Xiaoyan (Song, Xiaoyan.) (Scholars:宋晓艳) | Han, Qingchao (Han, Qingchao.) | Li, Lingmei (Li, Lingmei.)

Indexed by:

EI Scopus

Abstract:

The thermal features of the nanograin boundary were described by a developed thermodynamic model. Using the nanocrystalline Cu as an example, the pressure, the bulk modulus, and the volume thermal expansion coefficient were calculated to characterize the thermodynamic properties of the grain boundaries on the nanoscale. Based on the parabola-type relationship between the excess free energy and the excess volume of the nanograin boundary, the thermal stability, as well as its evolution characteristics, was analyzed. The experimental results of the temperature-varying grain growth in the nanocrystalline Cu, which exhibited the discontinuous nanograin growth behavior, verified the thermodynamic predictions. In addition, the quantitative relationships correlating the excess volume and the lattice expansion with the nanograin size were discussed. Printed by Copyright ©.

Keyword:

Grain growth Thermodynamic properties Nanocrystals Thermal expansion Free energy Thermodynamic stability Grain boundaries Expansion

Author Community:

  • [ 1 ] [Wei, Jun]College of Materials Science and Engineering, Key Laboratory of Advanced Functional Materials, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Song, Xiaoyan]College of Materials Science and Engineering, Key Laboratory of Advanced Functional Materials, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Han, Qingchao]College of Materials Science and Engineering, Key Laboratory of Advanced Functional Materials, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [Li, Lingmei]College of Materials Science and Engineering, Key Laboratory of Advanced Functional Materials, Beijing University of Technology, Beijing 100124, China

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Source :

Journal of Materials Science and Technology

ISSN: 1005-0302

Year: 2009

Issue: 4

Volume: 25

Page: 475-478

1 0 . 9 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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