Effect of heating rate on microstructure and mechanical properties of composite solder joints - Details

Author：

Tai, Feng (Tai, Feng.) | Guo, Fu (Guo, Fu.) (Scholars：郭福) | Shen, Hao (Shen, Hao.) | Han, Mengting (Han, Mengting.)

Indexed by：

EI Scopus PKU CSCD

Abstract：

The　different　soldering　processes　condition　has　been　found　to　play　a　significant　role　in　determining　the　intermetallic　compound　(IMC)　morphology　and　dimension　in　some　metallic　particulate　(such　as　Ni,　Ag,　and　Cu　metallic　particles)　reinforced　composite　solders,　and　the　morphology　and　dimension　of　IMCs　around　the　reinforced　particulate　have　an　influence　on　mechanical　propertirs　of　composite　solder　joints.　The　current　study　was　to　research　the　morphology　of　the　IMC　formed　around　the　metallic　Cu　reinforced　particulates　incorporated　in　the　Sn-3.5Ag　solder　by　mechanically,　and　the　mechanical　property　of　composite　solder　joints.　Experimental　results　indicated　that　the　different　heating　rate　have　no　influence　on　the　morphology　of　the　IMCs　formed　around　Cu　reinforced　particulate,　but　just　have　effect　on　the　thickness　of　the　IMCs　and　mechanical　property　of　composite　solder　joints.　The　relationship　between　dimension　of　IMCs　and　mechanical　property　in　different　processing　condition　was　established.

Keyword：

Reinforcement Silver alloys Lead-free solders Morphology Intermetallics Heating rate Mechanical properties Tin alloys Soldering Binary alloys Particle reinforced composites Copper

Author Community：

[ 1 ] [Tai, Feng]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Guo, Fu]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Shen, Hao]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Han, Mengting]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China