With　the　wide　use　of　flexible　transmission　technology,　IGBT　chip　technology　is　developing　rapidly.　The　stakpak　IGBT　chip　has　the　advantages　of　double-sided　heat　dissipation　that　the　traditional　welded　IGBT　does　not　have,　but　the　unclear　understanding　of　the　multi　physical　field　interaction　with　it　has　become　the　bottleneck　of　its　wide　application.　In　this　paper,　according　to　the　Fourier　expansion　formula,　the　simulation　model　is　built　by　SolidWorks,　and　the　finite　element　analysis　software　ANSYS　Workbench　is　used.　The　ANSYS　Workbench　sets　the　simulation　conditions　and　obtains　the　double-sided　heat　flux　of　the　stakpak　IGBT　sub　module,　and　compares　it　with　the　data　in　the　actual　working　condition　to　verify　the　accuracy　of　the　simulation,　so　as　to　provide　theoretical　support　for　the　improvement　of　the　stability　and　safety　of　the　stakpak　IGBT　device　in　operation.　©　2020　ACM.