Experiment　was　performed　to　investigate　the　local　heat　transfer　characteristics　from　a　simulated　microelectronic　chip　with　impingement　circular　free　surface　jet　using　dielectric　liquid　(L12378)　as　working　fluid.　Heat　transfer　coefficients　of　the　stagnation　point　and　lateral　location　were　determined.　The　results　reveal　that　stagnation　heat　transfer　coefficient　became　lager　with　the　increasing　of　Re　number　and　heat　flux　and　with　the　decreasing　of　nozzle　diameter　and　nozzle-to-plate　spacings.　It　is　shown　that　the　natural　convection　data　for　chip-size　heaters　are　as　high　as　four　times　of　the　predicted　values.　According　to　rigorous　procedures,　pool　boiling　heat　transfer　curve　under　subcooling　of　24　K　was　obtained.