• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

Guo, F. (Guo, F..) (Scholars:郭福)

Indexed by:

Scopus

Abstract:

Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders. © 2007 Springer Science+Business Media, LLC.

Keyword:

Author Community:

  • [ 1 ] [Guo, F.]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China

Reprint Author's Address:

  • [Guo, F.]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China

Show more details

Related Keywords:

Related Article:

Source :

Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics

Monograph name: Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics

Issue: Springer US

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 17

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 11

Online/Total:770/5309117
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.