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学者姓名：代岩伟
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Abstract ：
When it comes to electronics packaging, measuring the fracture toughness of adhesive materials is critical. Our research involved conducting double cantilever beam (DCB) tests to study the behavior of sintered silver in mode I fracture, which is doped with different weights of nickel-coated multiwall carbon nanotube additives. The results showed that when the sintered silver DCB adhesive joints contained 0.5 wt% nanofiller, their mode I fracture toughness increased to 0.0701 N/mm. This represents an 89.97 % improvement over the fracture toughness of sintered silver without nanofiller additives. The nickel-coated multiwall carbon nanotube nanofillers influenced both the microstructure characteristics and the propagation path of cracks in sintered silver. We used an inverse method to present cohesive zone models of sintered silver with varying nanofiller contents. The representative mode I resistance curves of sintered silver with different contents of nanofiller are also presented and discussed. The results of our study can help increase the reliability and strengthen the mode I fracture resistance for the sintered silver interconnection bonding layer by adding an appropriate nanofiller.
Keyword ：
Nickel coated multiwall carbon nanotubes Nickel coated multiwall carbon nanotubes Double cantilever beam test Double cantilever beam test Mode I fracture toughness Mode I fracture toughness Sintered silver Sintered silver
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| GB/T 7714 | Dai, Yanwei , Zhao, Libo , Zan, Zhi et al. Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube [J]. | MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING , 2024 , 174 . |
| MLA | Dai, Yanwei et al. "Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube" . | MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 174 (2024) . |
| APA | Dai, Yanwei , Zhao, Libo , Zan, Zhi , Qin, Fei . Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube . | MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING , 2024 , 174 . |
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Abstract ：
In order to improve the low temperature co-fired ceramic (LTCC) as the substrate of RF components in the work of high temperature problem, this paper aims to modify the internal structure and materials of T/R components, with the goal of improving the high-temperature working environment of T/R component chips. By doing so, it hopes to modify the heat transfer path of chips and the thermal conductivity of LTCC substrates, which will improve the heat dissipation performance of LTCC RF System-in-Package (SiP) components. Simulation is carried out using ICEPAK finite element software to simulate the model with increasing heat transfer path and increasing thermal conductivity of the structure. It is found that increasing the heat transfer path can effectively reduce the temperature of the TR component chip during operation, and the heat dissipation effect is improved less after further improving the thermal conductivity of the structure.
Keyword ：
Numerical simulation Numerical simulation Thermal resistance Thermal resistance LTCC LTCC T/R components T/R components
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| GB/T 7714 | Yang, Guang , Qin, Fei , Shi, Ge et al. Heat dissipation optimization study of LTCC-based RF SiP components [J]. | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
| MLA | Yang, Guang et al. "Heat dissipation optimization study of LTCC-based RF SiP components" . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024) . |
| APA | Yang, Guang , Qin, Fei , Shi, Ge , Dai, Yanwei . Heat dissipation optimization study of LTCC-based RF SiP components . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
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Abstract ：
Sintered nano-silver is a widely used interconnect material in the third generation of power semiconductors, and is often used for service in extremely high-temperature environments due to its advantages of high melting temperature, making the reliability of interconnection more and more important for the overall reliability of the third-generation power semiconductor device. Different from traditional fatigue life prediction methods, a thermal fatigue lifetime dataset is collected based on Coffin-Manson thermal fatigue model and finite element simulations in this paper. A data-driven method based on the Support Vector Regression (SVR) model for predicting fatigue lifetime of sintered nano silver layer is developed. The analysis includes identifying the key factors influencing interconnect reliability, and determining the main factors affecting the thermal fatigue lifetime of SiC modules. The results show that increasing the thickness of the sintered nano-silver interconnecting layer can enhance the lifetime of the interconnect structure, while elastic modulus and chip thickness negatively impact the lifetime of the sintered silver layer. The prediction accuracy and stability of the proposed data-driven SVR model are discussed and studied.
Keyword ：
Reliability Reliability Power module Power module Machine learning Machine learning Sintered silver Sintered silver Fatigue life Fatigue life
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| GB/T 7714 | Yu, Pengju , Dai, Yanwei , Qin, Fei . A machine learning framework to predict the thermal fatigue lifetime of SiC module with sintered silver layer [J]. | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
| MLA | Yu, Pengju et al. "A machine learning framework to predict the thermal fatigue lifetime of SiC module with sintered silver layer" . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024) . |
| APA | Yu, Pengju , Dai, Yanwei , Qin, Fei . A machine learning framework to predict the thermal fatigue lifetime of SiC module with sintered silver layer . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
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Abstract ：
T-peel test of ductile adhesive is always an interesting and important topic in peeling mechanics and fracture mechanics. In this paper, the pre-notch and pre-crack effect on the T-peel test with a ductile adhesive layer is studied. Based on the experimental test of SAC 305 adhesive and copper adherent T-peel tests, it is found that the peak loads, fracture toughness, resistance curve, and adhesive toughness are sensitive to pre-crack or pre-notch lengths. Short pre-notch or pre-crack trigger unsteady state debonding frequently, and deep pre-notch or pre- crack conditions achieve steady state debonding more easily. Different data reduction schemes such as simple beam theory (SBT), corrected beam theory (CBT), and compliance-based beam method (CBBM) will lead to variations of fracture toughness extractions for T-peel tests. Trapezoidal shape cohesive zone model (CZM) is found to be easier matching T-peel tests conducted in this paper. However, T-peel samples with shorter pre-notch or pre-crack lengths are hard to simulate with the CZM method due to the unstable crack propagation. The reasons, which may lead to the discrepancy between pre-notch and pre-crack T-peel samples, are also presented and discussed. The selection of different pre-notch or pre-crack lengths is a very important factor that needs to be considered in the T-peel test.
Keyword ：
T -peel T -peel Cohesive zone model Cohesive zone model Pre-crack Pre-crack Pre-notch Pre-notch Fracture toughness Fracture toughness
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| GB/T 7714 | Dai, Yanwei , Wang, Jianfeng , Yu, Jiarui et al. Pre-notch and pre-crack size effects on T-peel fracture behaviors of SAC305 solder joints [J]. | THEORETICAL AND APPLIED FRACTURE MECHANICS , 2024 , 131 . |
| MLA | Dai, Yanwei et al. "Pre-notch and pre-crack size effects on T-peel fracture behaviors of SAC305 solder joints" . | THEORETICAL AND APPLIED FRACTURE MECHANICS 131 (2024) . |
| APA | Dai, Yanwei , Wang, Jianfeng , Yu, Jiarui , Liu, Mengen , Qin, Fei . Pre-notch and pre-crack size effects on T-peel fracture behaviors of SAC305 solder joints . | THEORETICAL AND APPLIED FRACTURE MECHANICS , 2024 , 131 . |
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Abstract ：
During the operation of IGBT (Insulated Gate Bipolar Transistor), the power loss and junction temperature of the IGBT module vary with the usage conditions. This is mainly due to the mismatch in thermal expansion coefficients of different materials, which leads to thermal stress repeatedly acting on the solder layer. As a result, the solder layer may fail. Therefore, investigating solder layer damage is crucial for enhancing the reliability of IGBT modules. In this study, a three-dimensional finite element model of the IGBT module is established. The damage to the solder layer is investigated by simulating the reduction of solder layer area in different regions. Specifically, junction temperature (T-j), and maximum temperature (T-max) of various IGBT modules under power cycle conditions are recorded. This is done when the solder layer of the chip and copper baseplate is separately reduced by 10%, and when the areas of both solder layers are simultaneously reduced by 10%. Finally, the effects of solder layer damage in different regions on T-j and T-max are analyzed. The results obtained through finite element analysis indicate that T-j and T-max reach their maximum values when the areas of both solder layers are decreased simultaneously. Conversely, T-j and T-max are minimized when the area of the copper baseplate solder layer is reduced. Moreover, T-j and T-max increase as the area of the solder layer decreases.
Keyword ：
IGBT IGBT Finite element model Finite element model Junction temperature Junction temperature Solder layer Solder layer
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| GB/T 7714 | Song, Siyuan , An, Tong , Qin, Fei et al. Effect of different solder layer damage on junction temperature of IGBT module [J]. | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
| MLA | Song, Siyuan et al. "Effect of different solder layer damage on junction temperature of IGBT module" . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024) . |
| APA | Song, Siyuan , An, Tong , Qin, Fei , Gong, Yanpeng , Dai, Yanwei , Chen, Pei . Effect of different solder layer damage on junction temperature of IGBT module . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
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Abstract ：
Bonding strength of sintered nano silver (Ag) joints has been an important index for evaluating the reliability of power module packages, which has been reported to be influenced by many factors. However, it is hard to evaluate and predict those factors affecting bonding strength. With the help of artificial intelligence (AI), the utilization of AI tools to assist in finding science solutions has become a mainstream consensus. In this paper, we will show how to evaluate and predict those sintered nano Ag-Al bonded joints bonding strength with deep learning (DL) methods. Firstly, a reliable extended dataset was obtained using the Conditional Tabular Generative Adversarial Networks (CTGAN) based on the dataset of sintered Ag-Al interface shear strength with four different metallization layers under different high-temperature aging time with die shear test. Subsequently, four DL models were adopted to predict the shear strength of Ag-Al interface under different metallization layers to evaluate the interface bonding strength, all with high level of determination coefficient (R2, above 0.99) and classification accuracy (above 85%). Last but not least, factors influencing the shear strength of Ag-Al interface were analyzed and ranked by weight analysis and SHapley Additive exPlanations (SHAP) method. This research could provide a novel perspective on understanding those factors affecting the shear strength of sintered nano Ag interconnect layer in power devices.
Keyword ：
CTGAN CTGAN Sintered nano silver Sintered nano silver Deep learning model Deep learning model Interface bonding strength Interface bonding strength Power modules Power modules SHAP method SHAP method
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| GB/T 7714 | Zhao, Libo , Dai, Yanwei , Qin, Fei . Deep learning assisted prediction on main factors influencing shear strength of sintered nano Ag-Al joints under high temperature aging [J]. | ENGINEERING FAILURE ANALYSIS , 2024 , 167 . |
| MLA | Zhao, Libo et al. "Deep learning assisted prediction on main factors influencing shear strength of sintered nano Ag-Al joints under high temperature aging" . | ENGINEERING FAILURE ANALYSIS 167 (2024) . |
| APA | Zhao, Libo , Dai, Yanwei , Qin, Fei . Deep learning assisted prediction on main factors influencing shear strength of sintered nano Ag-Al joints under high temperature aging . | ENGINEERING FAILURE ANALYSIS , 2024 , 167 . |
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Abstract ：
In this paper, we presented three neural network models including deep neural network (DNN), recurrent neural network (RNN), and long short-term memory neural network (LSTM), which are proposed to predict the cohesive zone parameter of sintered silver DCB joint with different contents of nickel modified carbon nanotube, thus reducing the complexity of CZM parameter acquisition for nanoparticle reinforced adhesive. The bilinear CZM model is used as the prediction target model for sintered silver joints with different contents of nickel -modified carbon nanotube filler, and data sets suitable for different networks are established through experimental and numerical simulation results. Three kinds of networks are trained based on the optimized hyperparameters obtained from the Bayesian hyperparameters tuning process. The results show that DNN, RNN, and LSTM frameworks can all predict CZM parameters of nanoparticle-reinforced sintered silver adhesive through loaddisplacement curves. Based on loss analysis and statistical indicator comparison after K -fold cross -validation, the RNN and LSTM models have better prediction accuracy and performance than the DNN model, and the accuracy of the LSTM model is further improved compared with the DNN model. RNN and LSTM models have high prediction accuracy and stronger recognition ability for the time series data, they can be used as suitable alternative models for inverse recognition of CZM parameters of nanoparticle-reinforced adhesives, and have broad application prospects.
Keyword ：
Long short-term memory neural network Long short-term memory neural network (LSTM) (LSTM) Recurrent neural network (RNN) Recurrent neural network (RNN) Cohesive zone model Cohesive zone model Data-driven Data-driven Deep neural network Deep neural network
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| GB/T 7714 | Dai, Yanwei , Wei, Jiahui , Qin, Fei . Recurrent neural network (RNN) and long short-term memory neural network (LSTM) based data-driven methods for identifying cohesive zone law parameters of nickel-modified carbon nanotube reinforced sintered nano-silver adhesives [J]. | MATERIALS TODAY COMMUNICATIONS , 2024 , 39 . |
| MLA | Dai, Yanwei et al. "Recurrent neural network (RNN) and long short-term memory neural network (LSTM) based data-driven methods for identifying cohesive zone law parameters of nickel-modified carbon nanotube reinforced sintered nano-silver adhesives" . | MATERIALS TODAY COMMUNICATIONS 39 (2024) . |
| APA | Dai, Yanwei , Wei, Jiahui , Qin, Fei . Recurrent neural network (RNN) and long short-term memory neural network (LSTM) based data-driven methods for identifying cohesive zone law parameters of nickel-modified carbon nanotube reinforced sintered nano-silver adhesives . | MATERIALS TODAY COMMUNICATIONS , 2024 , 39 . |
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Abstract ：
To simulate structural crack propagation and predict fatigue life, the extended finite element method (XFEM) combined with the virtual crack closure technique (VCCT) is adopted in this paper. Firstly, the underlying principles of the XFEM-VCCT framework are elaborated comprehensively, mainly including the calculation of crack tip energy release rate based on VCCT, the simulation of element cracking utilizing the phantom nodes, and the computation of structural responses under cyclic loading through the direct cyclic analysis. In addition, to calculate the crack propagation length, an interpolation method to obtain the crack tip coordinates is developed based on tracking and locating the crack by the level set functions. Meanwhile, to compensate the defect that the fatigue life is often overestimated when dealing with the complex mode crack in complex structure through XFEM-VCCT, a simple improved algorithm based on the average rate concept is proposed without altering the XFEM-VCCT framework. Based on specific examples, the necessity and accuracy of the improved algorithm are fully verified by comparing with the original method, and the fatigue life predicted by the improved algorithm is more consistent with reality. Finally, this method is successfully applied to the simulation and analyses for a typical ship stiffened plate structure, demonstrating good engineering applicability.
Keyword ：
Fatigue crack propagation simulation Fatigue crack propagation simulation Virtual crack closure technology Virtual crack closure technology Extended finite element method Extended finite element method Energy release rate Energy release rate Improved fatigue life algorithm Improved fatigue life algorithm
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| GB/T 7714 | Chen, Zhiying , Dai, Yanwei , Liu, Yinghua . Structural fatigue crack propagation simulation and life prediction based on improved XFEM-VCCT [J]. | ENGINEERING FRACTURE MECHANICS , 2024 , 310 . |
| MLA | Chen, Zhiying et al. "Structural fatigue crack propagation simulation and life prediction based on improved XFEM-VCCT" . | ENGINEERING FRACTURE MECHANICS 310 (2024) . |
| APA | Chen, Zhiying , Dai, Yanwei , Liu, Yinghua . Structural fatigue crack propagation simulation and life prediction based on improved XFEM-VCCT . | ENGINEERING FRACTURE MECHANICS , 2024 , 310 . |
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Abstract ：
This work optimizes the liquid-cooled microchannels on the cold plate using a variable-density topology optimization [1] approach to increase the heat dissipation of transmit-receive modules within active phased array antennas and their dependability. Proposing a system-level channel heat dissipation,board-level and component-level sets make up the structure of the system-level channel cooling, with channel branches distributing flow from the board-level channels to the component-level microchannels. With fluid energy dissipation [2] and average temperature as goals, a two-dimensional variable-density topology optimization approach was used to optimize the microchannel architectures in COMSOL Multiphysics software. Thermal-fluid coupling simulations were performed using ICEPAK finite element software to compare the heat dissipation performance between system-level channel cooling and cold plate cooling, as well as the heat transfer efficiency between the optimized topology channels and conventional parallel cold plates. The finite element simulation results show that the Ushaped topology significantly improves the heat dissipation efficiency at the cold plate position when compared to the parallel channel construction at that location. Z-shaped topology at the transmit/receive module cover plate location offers better heat dissipation performance than parallel channels at the module cover plate position in system-level channel construction. Furthermore, the heat dissipation efficiency of the system-level channels is much higher than that of cold plate cooling.
Keyword ：
Microchannels Microchannels Numerical simulation Numerical simulation Active phased array Active phased array Topological optimization Topological optimization
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| GB/T 7714 | Shi, Ge , Qin, Fei , Yang, Guang et al. Heat dissipation optimization study of active phased array antenna microchannel [J]. | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
| MLA | Shi, Ge et al. "Heat dissipation optimization study of active phased array antenna microchannel" . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024) . |
| APA | Shi, Ge , Qin, Fei , Yang, Guang , Dai, Yanwei . Heat dissipation optimization study of active phased array antenna microchannel . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
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Abstract ：
This paper utilizes the cohesive zone model (CZM) and method of numerical computation to conduct inverse analysis, leveraging the existing experimental results of Single-Leg Bending(SLB) tests of sintered silver joints with different metallization layers. Based on experimental data, numerical inverse analysis was conducted to determine the cohesive zone model (CZM) parameters for sintered silver joints with varying metallization layers. Initially, curves of load and displacement (P-delta) are directly obtained from the SLB tests. Subsequently, by analyzing these experimental data, the interfacial fracture toughness of the sintered silver joints with different metallization layers is determined. A two-dimensional finite element model (FEM) for the three-point bending of an SLB sample is developed. Ultimately, the cohesive zone model of the sintered silver joints with different metallization layers is established. The research findings demonstrate that the interfacial fracture toughness is highest when the metallization layer is Ni/Ag. The results suggest that the numerical solutions are in good agreement with the experimental data.
Keyword ：
Cohesive zone model(CZM) Cohesive zone model(CZM) metallization layers metallization layers Sintered silver Sintered silver Numerical simulation Numerical simulation
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| GB/T 7714 | Liu, Xingyu , Dai, Yanwei , Kang, Rong et al. Determination of Cohesive Zone Model (CZM) and Numerical Analysis of Interface Fracture in Sintered Silver with Different Metallization Layers [J]. | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
| MLA | Liu, Xingyu et al. "Determination of Cohesive Zone Model (CZM) and Numerical Analysis of Interface Fracture in Sintered Silver with Different Metallization Layers" . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024) . |
| APA | Liu, Xingyu , Dai, Yanwei , Kang, Rong , Zhao, Libo , Qin, Fei . Determination of Cohesive Zone Model (CZM) and Numerical Analysis of Interface Fracture in Sintered Silver with Different Metallization Layers . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
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