Electrical property improvement in Cu@graphitic-carbon nanocables - 文章详情页

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摘要：

Nanocables　of　metallic　copper　nanowire　cores　coated　with　amorphous　carbon　(Cu@C　NCs)　and　graphitic　carbon　(Cu@G　NCs)　were　mass　synthesized　via　a　hydrothermal　approach　and　a　further　carbonization　process.　TEM　and　other　techniques　revealed　that　approximate　to　15　nm　thickness　graphitic　carbons　uniformly　encapsulated　the　well　crystallized　copper　nanowires　along　the　[110]　direction.　The　electrical　resistivity　measurement　indicated　that　the　Cu@C　NCs　are　insulating　while　the　Cu@G　NCs　are　conductive.　In　addition,　the　electrical　resistivity　of　a　single　Cu@G　NC　was　approximate　to　1.6158　x　10(-5)　Omega　cm　at　room　temperature,　lower　than　that　of　Cu　nanowires.　This　opens　a　door　to　broad　applications　in　nanoelectronics.　(C)　2016　Elsevier　B.V.　All　rights　reserved.

关键词：

Carbon materials Cu nanowire Electrical properties Electron microscopy Nanocables

作者机构：

[ 1 ] [Tian, Tian]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 2 ] [Liu, Danmin]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 3 ] [Zhang, Bo]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 4 ] [Zhang, Dandan]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 5 ] [Shao, Ruiwen]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 6 ] [Zheng, Kun]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 7 ] [Yan, Hui]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 8 ] [Zhang, Yongzhe]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 9 ] [Tian, Tian]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 10 ] [Liu, Danmin]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 11 ] [Zhang, Bo]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 12 ] [Zhang, Dandan]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 13 ] [Shao, Ruiwen]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 14 ] [Zheng, Kun]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
[ 15 ] [Liu, Danmin]Beijing Univ Technol, Educ Minist China, Key Lab Adv Funct Mat, Beijing 100124, Peoples R China
[ 16 ] [Yan, Hui]Beijing Univ Technol, Educ Minist China, Key Lab Adv Funct Mat, Beijing 100124, Peoples R China
[ 17 ] [Zhang, Yongzhe]Beijing Univ Technol, Educ Minist China, Key Lab Adv Funct Mat, Beijing 100124, Peoples R China
[ 18 ] [Yan, Hui]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
[ 19 ] [Zhang, Yongzhe]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

通讯作者信息：

刘丹敏
[Liu, Danmin]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China;;[Liu, Danmin]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing 100124, Peoples R China;;[Liu, Danmin]Beijing Univ Technol, Educ Minist China, Key Lab Adv Funct Mat, Beijing 100124, Peoples R China

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danminliu@163.com |
yzzhang@bjut.edu.cn

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