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Author:

Zhai, Yuwei (Zhai, Yuwei.) | Liang, Faguo (Liang, Faguo.) | Guo, Chunsheng (Guo, Chunsheng.) | Liu, Yan (Liu, Yan.)

Indexed by:

EI Scopus SCIE

Abstract:

The junction-to-case thermal resistance (R-theta JC) of a GaN/AlGaN HEMT is measured by Transient Dual Interface Method (TDIM). Different from other works about TDIM, an improved transient infrared microscope is used to measure the cooling curves, other than the traditional electrical method. Z(th) curves are used to determine the R-theta JC following the procedure of JESD51-14. The results demonstrate that the R-theta JC at 40 W power dissipation are about 0.791 K/W. In order to validate the method, measurements following MIL Std 833 have been done, and the results are consistent with the existing papers. (C) 2016 Elsevier Ltd. All rights reserved.

Keyword:

Infrared microscopy Transient dual interface measurement Junction-to-case thermal resistance GaN/AIGaN HEMT

Author Community:

  • [ 1 ] [Zhai, Yuwei]Hebei Semicond Res Inst, Metrol Ctr, Shijiazhuang 050051, Peoples R China
  • [ 2 ] [Liang, Faguo]Hebei Semicond Res Inst, Metrol Ctr, Shijiazhuang 050051, Peoples R China
  • [ 3 ] [Liu, Yan]Hebei Semicond Res Inst, Metrol Ctr, Shijiazhuang 050051, Peoples R China
  • [ 4 ] [Guo, Chunsheng]Beijing Univ Technol, Lab Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Zhai, Yuwei]Hebei Semicond Res Inst, Metrol Ctr, Shijiazhuang 050051, Peoples R China

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Source :

MICROELECTRONICS RELIABILITY

ISSN: 0026-2714

Year: 2016

Volume: 66

Page: 52-57

1 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:166

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 3

SCOPUS Cited Count: 4

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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