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Abstract:
The junction-to-case thermal resistance (R-theta JC) of a GaN/AlGaN HEMT is measured by Transient Dual Interface Method (TDIM). Different from other works about TDIM, an improved transient infrared microscope is used to measure the cooling curves, other than the traditional electrical method. Z(th) curves are used to determine the R-theta JC following the procedure of JESD51-14. The results demonstrate that the R-theta JC at 40 W power dissipation are about 0.791 K/W. In order to validate the method, measurements following MIL Std 833 have been done, and the results are consistent with the existing papers. (C) 2016 Elsevier Ltd. All rights reserved.
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MICROELECTRONICS RELIABILITY
ISSN: 0026-2714
Year: 2016
Volume: 66
Page: 52-57
1 . 6 0 0
JCR@2022
ESI Discipline: ENGINEERING;
ESI HC Threshold:166
CAS Journal Grade:4
Cited Count:
WoS CC Cited Count: 3
SCOPUS Cited Count: 4
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 0
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