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作者:

Zhai, Yuwei (Zhai, Yuwei.) | Liang, Faguo (Liang, Faguo.) | Guo, Chunsheng (Guo, Chunsheng.) | Liu, Yan (Liu, Yan.)

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EI Scopus SCIE

摘要:

The junction-to-case thermal resistance (R-theta JC) of a GaN/AlGaN HEMT is measured by Transient Dual Interface Method (TDIM). Different from other works about TDIM, an improved transient infrared microscope is used to measure the cooling curves, other than the traditional electrical method. Z(th) curves are used to determine the R-theta JC following the procedure of JESD51-14. The results demonstrate that the R-theta JC at 40 W power dissipation are about 0.791 K/W. In order to validate the method, measurements following MIL Std 833 have been done, and the results are consistent with the existing papers. (C) 2016 Elsevier Ltd. All rights reserved.

关键词:

GaN/AIGaN HEMT Infrared microscopy Junction-to-case thermal resistance Transient dual interface measurement

作者机构:

  • [ 1 ] [Zhai, Yuwei]Hebei Semicond Res Inst, Metrol Ctr, Shijiazhuang 050051, Peoples R China
  • [ 2 ] [Liang, Faguo]Hebei Semicond Res Inst, Metrol Ctr, Shijiazhuang 050051, Peoples R China
  • [ 3 ] [Liu, Yan]Hebei Semicond Res Inst, Metrol Ctr, Shijiazhuang 050051, Peoples R China
  • [ 4 ] [Guo, Chunsheng]Beijing Univ Technol, Lab Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

通讯作者信息:

  • [Zhai, Yuwei]Hebei Semicond Res Inst, Metrol Ctr, Shijiazhuang 050051, Peoples R China

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来源 :

MICROELECTRONICS RELIABILITY

ISSN: 0026-2714

年份: 2016

卷: 66

页码: 52-57

1 . 6 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:102

中科院分区:4

被引次数:

WoS核心集被引频次: 3

SCOPUS被引频次: 4

ESI高被引论文在榜: 0 展开所有

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