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作者:

Liu, Bendong (Liu, Bendong.) | Sun, Jianchuang (Sun, Jianchuang.) | Li, Desheng (Li, Desheng.) (学者:李德胜) | Zhe, Jiang (Zhe, Jiang.) | Oh, Kwang W. (Oh, Kwang W..)

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EI Scopus SCIE

摘要:

A thermal bubble-driven micropump with magnetic induction heating is successfully demonstrated in this paper. Energy is transferred from the planar coil outside the microchamber to the metal heating plate inside the microchamber through the electromagnetic field, and Joule heat is induced by the eddy current in the heating plate. Sequential photographs of bubble nucleation, growth and shrink in open environment were recorded by a CCD camera. One advantage of the micropump is that there is no physical contact between the heating plate and the external power supply circuit, which resulted in an easy fabrication process. What's more, compared with other thermal bubble-driven micropump with resistive microheater, the flow rate and the pump stroke have been improved significantly due to its larger dimension of the heating plate and larger bubbles volume. The experiments show that the maximum flow rate of this micropump is about 102.05 mu L/min, which can expand the potential applications, especially for microfluidic system that requires higher flow rate.

关键词:

Bubble Induction heating Microfluidics Micropump Phase change

作者机构:

  • [ 1 ] [Liu, Bendong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Sun, Jianchuang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Desheng]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Zhe, Jiang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Oh, Kwang W.]SUNY Buffalo, Dept Elect Engn, SMALL, Buffalo, NY 14260 USA

通讯作者信息:

  • [Liu, Bendong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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来源 :

MICROFLUIDICS AND NANOFLUIDICS

ISSN: 1613-4982

年份: 2016

期: 11

卷: 20

2 . 8 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:102

中科院分区:2

被引次数:

WoS核心集被引频次: 21

SCOPUS被引频次: 26

ESI高被引论文在榜: 0 展开所有

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