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Author:

Yan, Hengfeng (Yan, Hengfeng.) | Chen, Jimin (Chen, Jimin.) (Scholars:陈继民) | Zhao, Jinyan (Zhao, Jinyan.)

Indexed by:

EI Scopus SCIE

Abstract:

3D molded interconnect device (3D-MID) is a kind of injection-molded thermoplastic part with integrated electronic circuit traces. Currently, it is a hotspot of the electronic and telecommunication equipment industry. Laser direct structuring (LDS) is the main approach to fabricate 3D-MID. Laser scans and activates the surface of thermoplastic parts. After plating, the activated area is coated with copper. In this study, a model was built to describe the mechanisms of interaction between a substrate and laser. The nanosecond laser was applied in the LDS process to manufacture 3D circuit on 3D-MID. With the aid of variable laser pulse width, the model was confirmed by a series of experiments including investigations of roughness, surface structure and energy spectrum. Finally, critical factors affecting the LDS process were found out. They are effective guides for many LDS applications.

Keyword:

LDS thermoplastic 3D-MID

Author Community:

  • [ 1 ] [Yan, Hengfeng]Beijing Univ Technol, Inst Laser Engn, 6F Bldg A2, Beijing 100176, Peoples R China
  • [ 2 ] [Chen, Jimin]Beijing Univ Technol, Inst Laser Engn, 6F Bldg A2, Beijing 100176, Peoples R China
  • [ 3 ] [Zhao, Jinyan]Beijing Univ Technol, Inst Laser Engn, 6F Bldg A2, Beijing 100176, Peoples R China

Reprint Author's Address:

  • [Yan, Hengfeng]Beijing Univ Technol, Inst Laser Engn, 6F Bldg A2, Beijing 100176, Peoples R China

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Source :

JOURNAL OF POLYMER ENGINEERING

ISSN: 0334-6447

Year: 2016

Issue: 9

Volume: 36

Page: 957-962

2 . 0 0 0

JCR@2022

ESI Discipline: CHEMISTRY;

ESI HC Threshold:221

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 4

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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