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Abstract:
3D molded interconnect device (3D-MID) is a kind of injection-molded thermoplastic part with integrated electronic circuit traces. Currently, it is a hotspot of the electronic and telecommunication equipment industry. Laser direct structuring (LDS) is the main approach to fabricate 3D-MID. Laser scans and activates the surface of thermoplastic parts. After plating, the activated area is coated with copper. In this study, a model was built to describe the mechanisms of interaction between a substrate and laser. The nanosecond laser was applied in the LDS process to manufacture 3D circuit on 3D-MID. With the aid of variable laser pulse width, the model was confirmed by a series of experiments including investigations of roughness, surface structure and energy spectrum. Finally, critical factors affecting the LDS process were found out. They are effective guides for many LDS applications.
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JOURNAL OF POLYMER ENGINEERING
ISSN: 0334-6447
Year: 2016
Issue: 9
Volume: 36
Page: 957-962
2 . 0 0 0
JCR@2022
ESI Discipline: CHEMISTRY;
ESI HC Threshold:221
CAS Journal Grade:4
Cited Count:
WoS CC Cited Count: 4
SCOPUS Cited Count: 6
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 1