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Author:

Tao, Ran (Tao, Ran.) | Yang, Qing-Sheng (Yang, Qing-Sheng.) (Scholars:杨庆生) | He, Xiao-Qiao (He, Xiao-Qiao.) | Liew, Kim-Meow (Liew, Kim-Meow.)

Indexed by:

EI Scopus SCIE

Abstract:

Shape memory polymers (SMPs) are a class of intelligent materials, which are defined by their capacity to store a temporary shape and recover an original shape. In this work, the shape memory effect of SMP deployable hinged shell is simulated by using compiled user defined material subroutine (UMAT) subroutine of ABAQUS. Variations of bending moment and strain energy of the hinged shells with different temperatures and structural parameters in the loading process are given. The effects of the parameters and temperature on the nonlinear deformation process are emphasized. The entire thermodynamic cycle of SMP deployable hinged shell includes loading at high temperature, load carrying with cooling, unloading at low temperature and recovering the original shape with heating. The results show that the complicated thermomechanical deformation and shape memory effect of SMP deployable hinge are influenced by the structural parameters and temperature. The design ability of SMP smart hinged structures in practical application is prospected.

Keyword:

shape memory polymers deployable hinged shells finite element analysis

Author Community:

  • [ 1 ] [Tao, Ran]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China
  • [ 2 ] [Yang, Qing-Sheng]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China
  • [ 3 ] [He, Xiao-Qiao]City Univ Hong Kong, Dept Civil & Architectural Engn, Tat Chee Ave, Kowloon, Hong Kong, Peoples R China
  • [ 4 ] [Liew, Kim-Meow]City Univ Hong Kong, Dept Civil & Architectural Engn, Tat Chee Ave, Kowloon, Hong Kong, Peoples R China

Reprint Author's Address:

  • 杨庆生

    [Yang, Qing-Sheng]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China

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Related Keywords:

Source :

SMART MATERIALS AND STRUCTURES

ISSN: 0964-1726

Year: 2016

Issue: 11

Volume: 25

4 . 1 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:305

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 27

SCOPUS Cited Count: 27

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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