To　improve　the　heat　management　of　high-power　diode　lasers,　a　microchannel　heat　sink　is　obtained,　whose　structure　is　optimized　in　method　of　numerical　simulation.　Following　such　a　design,　the　microchannel　heat　sink　is　fabricated　by　nickel-based　doping　rare　earth　materials　by　laser　three-dimensional　(3-D)　printing　procedure.　Since　the　noncorrosion　property　of　such　material　has　been　preliminarily　demonstrated　by　salt　spray　test,　there　is　no　necessity　to　plate　the　interior　of　the　laser　3-D　printing　microchannel　heat　sink　with　gold.　The　coefficient　of　thermal　expansion　of　such　material　is　11　ppm/K.　The　diode　laser　array　(LDA)　with　80-W　cw　output　power,　2-mm　cavity　length,　100-mu　m　emitter　width,　and　20%　fill-factors　is　mounted　on　it　for　the　thermal　resistance　test,　and　the　result　is　0.40　K/W.　Moreover,　the　smile　effect　of　the　mounted　LDA　is　merely　0.8　mu　m.　(C)　2016　Society　of　Photo-Optical　Instrumentation　Engineers　(SPIE)