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Author:

Zheng, Xiang (Zheng, Xiang.) | Feng, Shiwei (Feng, Shiwei.) (Scholars:冯士维) | Zhang, Yamin (Zhang, Yamin.) | Yang, Junwei (Yang, Junwei.)

Indexed by:

EI Scopus SCIE

Abstract:

Time constant spectra are extracted from current transients based on the Bayesian deconvolution and used to characterize traps in GaN high-electron mobility transistors. Two kinds of traps with different time constants in an actual device were identified in the AIGaN barrier layer and the GaN layer, respectively. In particular, the trapping process in the AIGaN barrier layer was identified at the region near the drain side under gate contact. Trapping mechanisms of both two traps are discussed. Additionally, we observe that the trap in the AlGaN barrier layer requires sufficient electric field to activate the trapping process and a high drain voltage (V-ds) accelerates the trapping processes both in the AIGaN barrier layer and the GaN,layer. In addition, detrapping experiments with different filling conditions were performed to confirm their spatial positions. The influence of self-heating is excluded during the experiment by keeping the power density at a very low level, and the trapping effect is the sole factor accounting for the current transients. (C) 2016 Elsevier Ltd. All rights reserved.

Keyword:

Current transients Trapping effect High-electron mobility transistors (HEMTs) GaN Time constant spectrum

Author Community:

  • [ 1 ] [Zheng, Xiang]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 2 ] [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang, Yamin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 4 ] [Yang, Junwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 冯士维

    [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

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Source :

MICROELECTRONICS RELIABILITY

ISSN: 0026-2714

Year: 2016

Volume: 63

Page: 46-51

1 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:166

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 22

SCOPUS Cited Count: 32

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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