Glass　is　a　promising　substitute　substrate　material　being　evaluated　for　electronic　packaging　technology.　Improving　the　electroless　copper　plated　layer　adhesion　of　the　glass　is　one　of　the　most　important　considerations　for　development　of　the　technology.　An　excimer　laser　(248　nm)　was　used　for　structured　texturing　of　glass　surfaces　(to　improve　adhesion)　by　changing　mask　dimensions,　laser　operating　parameters　and　overlapping　pitch　spacing,　and　therefore　producing　a　range　of　micro-scale　features.　Electroless　plated　copper　adhesion　strength　was　assessed　using　quantitative　scratch　testing,　demonstrating　that　micro-patterned　structures　can　significantly　improve　copper/glass　adhesion.　New　ISO　25178　Part　2　areal　surface　texture　parameters　were　used　to　characterise　the　surface　roughness　of　ablated　glass　surfaces,　and　correlated　to　the　scratch　testing　results.　Highly　correlated　parameters　were　identified　that　could　be　used　as　predictive　surface　design　tools,　directly　linking　surface　topography　to　adhesion　performance,　without　the　need　for　destructive　adhesion　quantification　via　scratch　testing.　(C)　2015　Elsevier　Ltd.　All　rights　reserved.