3D-IC　is　getting　increasingly　attractive,　as　it　improves　speed　and　frequency　and　reduces　power　consumption,　noise　and　latency.　However,　three-dimension　(3D)　integration　technology　brings　a　new　serious　challenge　to　chip　thermal　management　with　the　power　density　increased　exponentially.　Interlayer　micro-channel　liquid　cooling　is　a　promising　and　scalable　solution　for　high　heat　flux　removal　in　3D-IC.　The　effects　of　geometric　parameters　on　fluid　flow　and　heat　transfer　characteristics　in　interlayer　micro-channel　cooling　for　3D-IC　with　triangular　reentrant　cavities　(TRC)　and　fan-shaped　reentrant　cavities　(FRC)　are　numerically　investigated.　3D-IC　with　TRC　and　FRC　for　pitch　=　0.1/0.2　mm　and　height　=　0.2　mm　are　analyzed　and　compared　with　rectangular　micro-channel　(RMC)　for　1　cm(2)　heat　areas.　Results　show　that　the　heat　rate　and　pressure　drop　distributions　of　each　layer　for　length　=　5　mm　and　pitch　=　0.2　mm　are　more　uniform.　The　micro-channels　of　pitch　=　0.1　mm　have　better　heat　transfer　performance,　simultaneously　cause　the　pressure　drop　and　pumping　power　increasing　sharply,　which　are　undesirable　and　uneconomical　for　3D-IC.　For　smaller　Re,　the　micro-channels　with　surface　enhancement　structures　TRC　and　FRC　deteriorate　heat　transfer.　While　at　the　larger　Re,　heat　transfer　is　enhanced,　which　can　be　attributed　to　heat　transfer　area　increased,　boundary　layer　thinned,　boundary　layer　interrupted　and　chaotic　advection　by　generating　vortices.　The　3D-IC　with　FRC-L5-P0.2　has　better　heat　transfer　performance　and　lowest　pumping　power,　which　is　more　suitable　and　economical　for　3D-IC　inter-layer　cooling.　For　channel　length　of　10　mm,　the　fluid　temperature　is　higher　in　the　last　5　mm,　which　deteriorates　heat　transfer　effect,　simultaneously　the　longer　length　leads　to　pumping　power　and　flow　resistance　enlarged.　Besides,　3D-IC　with　FRC　decreases　the　laminar　stagnation　zones　and　improves　the　heat　transfer　performance,　due　to　owning　bigger　included　angle　of　the　expansion　and　constriction　walls　in　channel.　(C)　2015　Elsevier　Ltd.　All　rights　reserved.