Life　prediction　plays　an　important　role　in　reliability　design　of　electronic　product.　Solder　joint　failure　is　one　of　the　most　common　failure　modes　for　electronic　packaging　structure.　Current　creep-fatigue　life　models　of　solder　joints　are　unable　to　distinguish　the　creep　damage　and　fatigue　damage.　In　this　work,　a　new　creep-fatigue　life　model　was　proposed　for　solder　joint　tested　under　high　strain　rate,　where　the　creep　damage　was　based　on　Monkman-Grant　equation　and　the　fatigue　damage　was　evaluated　employing　the　Coffin-Manson　model.　Then,　linear　damage　rule　was　utilized　to　build　the　new　model.　Creep　test,　fatigue　test　and　creep-fatigue　test　were　conducted　respectively　in　order　to　determine　the　parameter　in　the　new　model.　At　last,　the　experimental　result　was　compared　with　the　predicted　result,　which　shows　that　the　calculation　life　meets　well　with　the　experimental　life　under　high　strain　rate.　(C)　2015　Elsevier　Ltd.　All　rights　reserved.