Controlling　and　monitoring　of　dynamic　responses　are　very　important　to　ensure　consistent　test　results　and　understand　mechanical　behaviors,　as　they　are　closely　related　to　the　solder　joint　failure　mechanism.　The　failure　of　a　solder　joint　during　drop　impact　is　induced　by　printed　circuit　board　(PCB)　bending.　The　failure　criteria　must　be　clear　to　determine　the　absolute　impact　life　for　direct　comparison　of　drop　test　results.　In　this　publication,　a　multi-channel　real　time　electrical　monitoring　system　is　introduced,　which　can　measure　the　dynamic　voltage　of　daisy-chained　solder　joints　in　real-time　during　drop　impact.　A　new　failure　criteria　of　board　level　drop　test　is　developed,　which　takes　the　function　of　the　component　into　account.