The　eutectic　point　of　Zn-6Al　alloy　is　381A　degrees　C,　and　the　peritectic　reaction　of　Zn-Al-Sn　alloy　occurs　at　280A　degrees　C.　In　order　to　find　an　alloy　with　an　appropriate　melting　point　between　280A　degrees　C　and　340A　degrees　C,　Zn-6Al-5Sn,　Zn-6Al-10Sn,　Zn-6Al-15Sn,　and　Zn-6Al-20Sn　alloys　were　prepared.　The　microstructure,　melting　behavior,　and　wettability　of　the　Zn-6Al-xSn　solder　alloys　were　investigated　by　scanning　electron　microscopy　(SEM),　differential　scanning　calorimetry　(DSC),　and　the　sessile　drop　method.　The　results　show　that　the　alloys　were　composed　of　Zn-rich　phase,　Zn-Al　structure,　Sn-Zn-Al　peritectic　structure,　and　Sn-Zn　eutectic　structure.　The　progressive　decrease　of　the　liquidus　temperature　of　the　Zn-6Al-xSn　solders　was　confirmed　by　the　DSC　results　in　the　order:　Zn-6Al-5Sn,　Zn-6Al-10Sn,　Zn-6Al-15Sn,　Zn-6Al-20Sn.　A　decrease　of　the　wetting　angle,　selected　for　evaluation　of　the　solderability　of　the　Zn-6Al-xSn　solders,　was　observed　in　the　same　order.　The　cross-section　of　a　solder　joint　on　a　Cu　substrate　was　examined　by　SEM　coupled　with　energy-dispersive　x-ray　(EDS)　analysis.