The　cold　rolling　texture　and　recrystallization　texture　of　the　99　%　reduced　Cu-45Ni　alloy　substrates　with　thickness　of　80　and　40　gm　were　investigated　by　XRD.　The　recrystallization　evolution　of　those　two　Cu-45Ni　alloy　substrates　were　also　investigated　by　electron　backscattered　diffraction　(EBSD).　The　cube　texture　formation　of　Cu-45Ni　alloy　substrates　with　different　thicknesses　were　demonstrated　from　the　fraction　of　cube　texture,　low　angle　grain　boundaries,　and　the　average　grain　size.　The　results　show　that　a　＂Copper＂　type　rolling　texture　is　obtained　after　99%　deformation　reduction　for　both　two　tapes,　and　the　rolling　texture　causes　little　impact　on　the　cube　texture　formation.　The　substrates　with　40　mu　m　in　thickness　have　a　stronger　cube　texture　and　a　high　fraction　of　low　angle　grain　boundaries.　It　is　because　the　probability　is　higher　that　two　cube　grains　meet　and　grow　up　fast　to　form　a　strong　cube　texture　in　the　substrate　with　small　thickness　during　partial　recrystallization.