Electromigration　(EM),　creep,　and　thermal　fatigue　(TF)　are　the　most　important　aspects　of　the　reliability　of　electronic　solder　joints,　the　failure　mechanisms　of　which　used　to　be　investigated　separately.　However,　current,　mechanical　loading,　and　temperature　fluctuation　usually　co-exist　under　real　service　conditions,　especially　as　the　magnitude　of　current　density　is　increasing　with　joint　miniaturization.　The　importance　of　EM　can　no　longer　be　simply　ignored　when　analyzing　the　creep　and　TF　behavior　of　a　solder　joint.　The　published　literature　reports　that　current　density　substantially　changes　creep　rate,　but　the　intrinsic　mechanism　is　still　unclear.　Hence,　the　purpose　of　this　study　was　to　investigate　the　effects　of　EM　on　the　creep　and　TF　behavior　of　Sn58Bi　solder　joints　by　analyzing　the　evolution　of　electrical　resistance　and　microstructure.　The　results　indicated　that　EM　shortens　the　lifetime　of　creep　or　TF　of　Sn58Bi　solder　joints.　During　creep,　EM　delays　or　suppresses　the　cracking　and　deforming　process,　so　fracture　occurs　at　the　cathode　interface.　During　TF,　EM　suppresses　the　cracking　process　and　changes　the　interfacial　structure.