英文标题
Research on deforming mechanism of nanocrystalline Cu thin film under contact deformation
英文摘要
In this paper, magnetron sputtering and Lithography technology were used to fabricate the “Cu/photoresist/ SiO2/Si”structure. Indentation deformation was conducted on Cu nanocrystalline thin film ( approximately 50nm) with indenter. Using the developed thin film in?situ transmission technology, the thin film with indentation area could be directly transformed onto the copper grid for in?situ transmission electronic microscope research ( TEM ) . The deforming mechanism of nanocrystalline Cu thin film in indentation area was observed by high resolution electronic microscope ( HRTEM ) . The results showed that deformation twinning constituted the main deformation mode in the grains ( ＜40nm). TEM results presented that twinning could be formed by the emission of partial dislocations from grain boundary, which could change the shape of grain. On the other hand, the self?multiplication of partial dislocation in the grain could also form the deformation twinning on the twinning plane under local stress.
翻译关键词
partial dislocation
Cu film
nano-indentation
deformation twinning
获取号
WF:perioarticaldzxwxb201505007
