In　this　study,　low-cycle　fatigue　test　was　conducted　for　a　lead-free　solder　joint　at　two　test　temperatures　(348　K,　398　K)　and　three　strain　amplitudes　(3%,　4%,　and　8%).　Fatigue　failure　behavior　was　analyzed　and　the　fatigue　life　was　evaluated　using　the　Coffin-Manson　relationship　and　Morrow　energy-based　model.　The　results　show　that　the　maximum　load　gradually　drops　with　increasing　the　number　of　loading　cycles.　When　the　strain　range　or　temperature　is　low,　the　maximum　load　drop　curve　can　be　divided　into　three　stages.　Then,　it　degrades　into　a　linear　stage　with　increasing　the　strain　range　or　temperature.　Both　the　softening　of　solder　and　the　reduction　of　effective　load-bearing　area　are　responsible　for　the　maximum　load　drop　depending　on　the　test　condition.　Fatigue　crack　initiates　at　the　corner　of　the　solder　joint　and　propagates　along　the　strain　concentrated　zone.　Spacing　distance　between　fatigue　striations　is　enlarged　with　increasing　the　temperature　in　accordance　with　the　degradation　of　fatigue　resistance.　In　addition,　both　the　Coffin-Manson　model　and　Morrow　energy-based　model　can　be　used　to　evaluate　the　fatigue　life　of　solder　joint　under　high　temperature.　The　fatigue　ductility　exponent　cc　in　Coffin-Manson　model　and　the　fatigue　ductility　coefficient　C　in　Morrow　model　are　dependent　on　temperature,　whereas　other　parameters　in　these　two　models　keep　stable　under　different　temperature.　(C)　2014　Elsevier　Ltd.　All　rights　reserved.