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作者:

Li, Guodong (Li, Guodong.) | Li, Zhuoxin (Li, Zhuoxin.) | Li, Hui (Li, Hui.) | Shi, Yaowu (Shi, Yaowu.)

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EI Scopus SCIE

摘要:

A novel Er-doped Mg-Zn-Al solder was developed by using ultrasonic vibration technology. The inclusions in the solder were analyzed. The microstructure of the solder and its soldering lap joint was investigated, and the shear strength of the joint was measured. It was found that the inclusions in the solder decreased greatly, the alpha-Mg phase and Al3Er compound were broken up into granular structure after ultrasonic vibration treatment. The alpha-Mg phase and Al3Er compound in the soldered joint showed similar structure as that of the original solder. The average shear strength of the soldered joints by using the ultrasonic treated filler metal was almost 1.25 times as large as that soldered by the traditional one. (C) 2014 Elsevier B.V. All rights reserved.

关键词:

Microstructure Ultrasonic treatment Magnesium alloy solder Mechanical property Inclusions

作者机构:

  • [ 1 ] [Li, Guodong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Li, Zhuoxin]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Hui]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Shi, Yaowu]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

通讯作者信息:

  • [Li, Guodong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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来源 :

MATERIALS LETTERS

ISSN: 0167-577X

年份: 2014

卷: 136

页码: 59-62

3 . 0 0 0

JCR@2022

ESI学科: MATERIALS SCIENCE;

ESI高被引阀值:341

JCR分区:1

中科院分区:2

被引次数:

WoS核心集被引频次: 5

SCOPUS被引频次: 5

ESI高被引论文在榜: 0 展开所有

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