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作者:

Liu, X. -D. (Liu, X. -D..) | Shang, D. -G. (Shang, D. -G..) (学者:尚德广) | Zhang, Li. -H. (Zhang, Li. -H..) | Sun, Y. -J. (Sun, Y. -J..) | Chen, T. (Chen, T..)

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EI Scopus SCIE

摘要:

A healing method for fatigue damage was studied by laser shock peening (LSP) with excimer laser for polycrystalline copper film. It is found that work hardening due to LSP could be responsible for the improvement of residual fatigue lives for the damaged and undamaged specimens by LSP, and the hardening degree for the damaged specimen by LSP is obviously higher than that for the undamaged specimen by LSP. In this paper, two basic mechanisms were identified. One is the dissipated energy enhancement mechanism, which improves the fatigue life caused by laser shock stress, and the other is the healing mechanism, which leads to a further improvement. Based on the two mechanisms, a residual fatigue life prediction method is proposed by the view of energy consumption before and after LSP. The predicted lives by the proposed method agree well with the experimental results.

关键词:

dissipated energy enhancement mechanism healing mechanism laser shock peening life prediction work hardening

作者机构:

  • [ 1 ] [Liu, X. -D.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Shang, D. -G.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang, Li. -H.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Sun, Y. -J.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Chen, T.]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

通讯作者信息:

  • 尚德广

    [Shang, D. -G.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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来源 :

FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES

ISSN: 8756-758X

年份: 2014

期: 4

卷: 37

页码: 427-435

3 . 7 0 0

JCR@2022

ESI学科: MATERIALS SCIENCE;

ESI高被引阀值:256

JCR分区:2

中科院分区:3

被引次数:

WoS核心集被引频次: 9

SCOPUS被引频次: 9

ESI高被引论文在榜: 0 展开所有

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中文被引频次:

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