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Author:

Yan, A-R. (Yan, A-R..) | Li, Y-J. (Li, Y-J..) | Wang, Z-Y. (Wang, Z-Y..) (Scholars:王智勇)

Indexed by:

EI Scopus SCIE

Abstract:

Using a high power diode laser (HPDL) to deposit a cermet composite coating of Cu-WC-Ni on brass substrate in order to increase surface abrasion resistance whilst maintaining good electrical conductivity. The microstructure of the coating was studied by using an optical microscope, a scanning electron microscope (SEM) and X-ray diffraction (XRD) analysis. The hardness, abrasion resistance and conductivity was studied by using a microhardness tester, sliding friction pin-disk tester and a resister tester, respectively. It is concluded that the phases of the Cu-WC-Ni composite coating constitute WC and W2C grains; alpha-Cu, beta-Cu, gamma-Cu dendritic crystals and intermetallic compounds of Cr4Ni15W, WC and W2C are evenly distributed in the coating. With the increase in WC content the dendritic crystal microstructure is refined, average hardness and abrasion resistance increase accordingly when the mass fraction of WC reaches 25%, the average hardness of the coating is four-times the base metal, abrasion loss is decreased to 1/19 that of the base metal, and the conductivity is as before.

Keyword:

laser cladding High power diode laser (HPDL) Ni-Cu alloy composite coating wear abrasion resistance WC brass electrical conductivity

Author Community:

  • [ 1 ] [Yan, A-R.]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Li, Y-J.]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Wang, Z-Y.]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Yan, A-R.]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

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Source :

LASERS IN ENGINEERING

ISSN: 0898-1507

Year: 2014

Issue: 5-6

Volume: 29

Page: 365-377

0 . 5 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:176

JCR Journal Grade:4

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 1

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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