Reaction-bonded　silicon　carbide　was　joined　using　a　polysiloxane　silicon　resin　YR3187.　Residual　thermal　stress　distribution　in　joint　structure　was　calculated　by　finite　element　analysis　method.　Factors　influencing　the　distribution　of　residual　thermal　stress,　including　joining　temperature,　thickness　of　join　layer,　and　presence　of　crack　in　join　layer,　were　studied.　The　simulated　results　were　compared　with　actual　joint　strength.　It　is　showed　that　in　determining　the　joining　temperature,　the　pyrolysis　procedure　of　silicon　resin　should　be　taken　into　consideration;　in　addition,　the　reasonable　thickness　of　the　join　layer　and　the　reduction　of　cracks　in　join　layer　are　important　to　obtain　higher　joint　strength.