The　intermetallic　compound　(IMC)　growth　behavior　at　SnAgCu/Cu　solder　joint　interface　under　different　thermal　aging　conditions　was　investigated,　in　order　to　develop　a　framework　for　correlating　IMC　layer　growth　behavior　between　isothermal　and　thermomechanical　cycling　(TMC)　effects.　Based　upon　an　analysis　of　displacements　for　actual　flip-chip　solder　joint　during　temperature　cycling,　a　special　bimetallic　loading　frame　with　single　joint-shear　sample　as　well　as　TMC　tests　were　designed　and　used　to　research　the　interfacial　IMC　growth　behavior　in　SnAgCu/Cu　solder　joint,　with　a　focus　on　the　influence　of　stress-strain　cycling　on　the　growth　kinetics.　An　equivalent　model　for　IMC　growth　was　derived　to　describe　the　interfacial　Cu-Sn　IMC　growth　behavior　subjected　to　TMC　aging　as　well　as　isothermal　aging　based　on　the　proposed　＂equivalent　aging　time＂　and　＂effective　aging　time＂.　Isothermal　aging,　thermal　cycling　(TC)　and　TMC　tests　were　conducted　for　parameter　determination　of　the　IMC　growth　model　as　well　as　the　growth　kinetic　analysis.　The　SnAgCu/Cu　solder　joints　were　isothermally　aged　at　125,　150　and　175　degrees　C,　while　the　TC　and　TMC　tests　were　performed　within　the　temperature　range　from　-40　to　125　degrees　C.　The　statistical　results　of　IMC　layer　thickness　showed　that　the　IMC　growth　for　TMC　was　accelerated　compared　to　that　of　isothermal　aging　based　on　the　same　＂effective　aging　time＂.　The　IMC　growth　model　proposed　here　is　fit　for　predicting　the　IMC　layer　thickness　for　SnAgCu/Cu　solder　joint　after　any　isothermal　aging　time　or　thermomechanical　cycles.　In　addition,　the　results　of　microstructure　evolution　observation　of　SnAgCu/Cu　solder　joint　subjected　to　TMC　revealed　that　the　interfacial　zone　was　the　weak　link　of　the　solder　joint,　and　the　interfacial　IMC　growth　had　important　influence　on　the　thermomechanical　fatigue　fracture　of　the　solder　joint.