In　this　work,　a　one-step　thermal　plasma　synthesis　route　was　developed　to　construct　core-shell　W-Cu　nanoparticles　with　size　about　30　nm.　As　synthesized　nanocomposite　powders　address　the　issues　of　homogeneous　elemental　distribution　and　short　diffusion　distance　for　Cu　to　form　network　around　W　grains,　facilitating　fast　densification　with　uniform　microstructure　and　suppressed　W　grain　growth.　As　a　result,　compact　with　high　relative　density　of　99.31%　and　grain　size　of　260　nm　was　obtained　at　low　temperature　of　1100　degrees　C,　further　led　to　the　recorded　hardness　of　562　Vickers-hardness　(Hv)　and　electrical　conductivity　of　54.32%　International　Annealed　Copper　Standard　(IACS),　respectively.　(C)　2020　Elsevier　B.V.　All　rights　reserved.