通过筛选试验,调整溶剂、松香和活化剂的含量,确定助焊剂中主要成分的最佳配比.根据国标GB/T 9491-2002,测试助焊剂的扩展率、腐蚀性及其他性能,并根据日本工业标准JIS Z 3198-4-2003进行润湿力测试.结果表明:当助焊剂中有机酸活化剂质量分数为9%、m(水白松香) : m(聚合松香)为2:3时,助焊剂具有良好的物理稳定性和润湿性,平均扩展率最高能达到76.00%.焊后铜片无腐蚀,残留物少且成透明膜状.
关键词：
无铅焊膏
活化剂
扩展率
助焊剂
作者机构：
[ 1 ]
[祝蕾]北京工业大学
[ 2 ]
[雷永平]北京工业大学
[ 3 ]
[夏志东]北京工业大学
[ 4 ]
[林健]北京工业大学
[ 5 ]
[尹兰礼]北京工业大学
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英文标题
Development of halogen-free rosin-based flux for lead-free solder paste
英文摘要
The contents of solvent, rosin and activator were adjusted to obtain the most appropriate proportion of the flux by a series of screening tests. The spreading rate, corrosivity and other performance of optimized fluxes were tested according to GB/T 949-2002. And the wetting force was tested with JIS Z 3198-4-2003. When the mass fraction of organic acid activator is 9% and the mass rate of two different rosins is 2:3, the flux shows good physical stability and wettability, and average spreading rate of the flux is up to 76.00%. There is no corrosion and less residue in the form of transparent membrane on the soldered Cu piece.
