Cu-Ni-Si　alloy　is　widely　used　in　electronics　industry　due　to　its　high　electrical　conductivity　and　high　strength.　In　this　paper,　the　Cu-Ni-Co-Si-Cr　alloy　is　prepared　by　ZG-0.01　vacuum　frequency　induction　melting　furnace.　The　hot　compression　tests　of　the　Cu-1.5Ni-1.1Co-0.65Si-0.2Cr　alloy　were　carried　out　using　the　Gleeble-1500　simu-lator　at　0.001-10　s(-1)　strain　rates　and　500-900　degrees　C　deformation　temperatures.　The　microstructure　changes　of　the　alloy　at　500-900　degrees　C　were　studied.　The　changes　in　the　hot　deformation　process　for　the　Cu-1.5Ni-1.1Co-0.65Si0.2Cr　alloy　were　analyzed　by　EBSD.　The　dislocation　density　was　sacrificed　to　promote　recrystallization.　The　DRX　grains　texture　of　the　alloy　at　700　degrees　C　is　{001}　＜　100　＞　{011}　＜　100　＞　Goss　texture　at　900　degrees　C.　And　the　higher　deformation　temperature　makes　the　texture　more　random　by　lowering　the　texture　intensity.　The　precipitates　of　the　Cu-1.5Ni-1.1Co-0.65Si-0.2Cr　alloy　are　mainly　disk　shaped　and　rod-shaped　(Ni,　Co)(2)Si.　The　constitutive　equation　of　the　Cu-1.5Ni-1.1Co-0.65Si-0.2Cr　alloy　was　established　to　predict　the　behavior　of　the　flow　stress,　and　the　activation　energy　is　634.45KJ/mol.　Due　to　precipitation-hardened　caused　by　(Ni,　Co)(2)Si,　the　activation　energy　of　the　Cu-1.5Ni-1.1Co-0.65Si-0.2Cr　alloy　was　much　higher　than　the　self-diffusion　activation　energy　of　pure　copper.　And　the　CDRX　and　DDRX　mechanisms　are　two　dominant　DRX　mechanisms　for　the　Cu-1.5Ni-1.1Co-0.65Si-0.2Cr　alloy.