Composite　substrate　which　has　high　mechanical　property　and　low　magnetic　property　and　is　easy　to　form　the　sharp　cube　texture　in　the　outer　layer　can　satisfy　the　requirements　of　the　advanced　metallic　substrate　used　for　coated　conductors.　The　Ni5W/Ni12W/Ni5W　composite　substrate　has　been　fabricated　by　sparking　Plasma　Sintering　(SPS)　followed　by　traditional　cold　rolling　and　recrystallization　annealing.　The　investigation　on　the　interface　between　the　inner　layer　and　the　outer　layer　of　the　composite　substrate　that　the　diffusing　layer　is　beneficial　for　formation　of　the　cube　texture　in　outer　layer　of　the　substrate.　The　fractions　of　cube　texture　on　the　surface　of　the　outer　Ni5W　layer　in　the　composite　substrate　all　exceed　98%,　when　the　substrate　is　annealed　at　1250　degrees　C　for　60,　120　and　180　min　respectively.　This　is　possibly　caused　by　element　mutual　diffusion　during　the　heat-treatment　process　in　the　diffusion　layer.　The　grain　abnormal　growth　has　been　restrained　duo　to　W　atom　pinning　in　grain-boundary　diffused　from　inner　layer,　subsequently　stabilizing　the　cube　texture　of　the　outer　layer　during　the　severely　annealing　process.